Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package
作者： Ville Pekkanen , Matti Mäntysalo , Kimmo Kaija , Pauliina Mansikkamäki , Esa Kunnari
DOI: 10.1016/J.MEE.2010.04.013
关键词:
摘要: The printed interconnections for encapsulated electronic packages using nanoparticle metal inks and polymer dielectrics have been demonstrated. printing has utilized a digital method, inkjet printing. process adopted rather well, but yield improvement required more attention to the control of individual manufacturing stages error sources. sources possible errors can be roughly divided into separate groups: substrate-ink interaction treatment procedure related, ink jetting moving stage related. In this paper, were taken under consideration. performance was studied statistical methods. affecting factors classified, designed experiments carried out determine most significant create model describe behavior. According models, optimized parameters achieved, implemented in practice.
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