作者: Partha Mitra , Arthur F. Hebard
DOI: 10.1063/1.1861953
关键词:
摘要: We present a systematic in situ study of the effect postdeposition low-energy (200eV) ion bombardment on resistance and surface topography ultrathin iron (<50A) copper (<130A) films. The ion-beam-induced nanosmoothening occurs while material is being removed gives rise to an initial decrease followed by steady increase as film subsequently uniformly eroded. shunt associated with found be independent thickness underlying film, thus indicating that conductivity enhancement due primarily modification.