Three-dimensional non-volatile memory device, memory system including the same and method of manufacturing the same

作者: Yong Mook Baek , Jung Ryul Ahn

DOI:

关键词:

摘要: A three-dimensional (3-D) non-volatile memory device includes a plurality of vertical channel layers protruding from substrate, interlayer insulating and cells stacked alternately along the layers, an air gap formed in disposed between cells, so that capacitance word lines is reduced to thus improve program speed.

参考文章(7)
Megumi Ishiduki, Masaru Kidoh, Ryota Katsumata, Hideaki Aochi, Yosuke Komori, Yoshiaki Fukuzumi, Hiroyasu Tanaka, Masaru Kito, Non-volatile semiconductor storage device and method of manufacturing the same ,(2009)
Lee Jung Hyun, Kim Young Eal, Ma Dong Joon, Lee Chang Soo, NONVOLATILE MEMORY DEVICE HAVING VERTICAL FOLDING STRUCTURE AND METHOD OF FABRICATING THE SAME ,(2010)
Kim Beom Yong, Lee Ki Hong, Lee Kee Jeung, Hong Kwon, 3d structured non-volatile memory device and method for manufacturing the same ,(2012)
Yamada Satoru, Sung-Hwan Kim, Method of Manufacturing Semiconductor Device ,(2010)