Package structure and methods of forming same
作者： Jui Hsieh Lai , Tien-I Bao , Ying-hao Kuo , Hai-Ching Chen
DOI:
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摘要: A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is device comprising first optical over substrate, vertical waveguide on top surface second substrate waveguide. The further comprises lens capping layer wherein aligned with waveguide, layer.
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