Imprint of sub-25 nm vias and trenches in polymers
作者： Stephen Y. Chou , Peter R. Krauss , Preston J. Renstrom
DOI: 10.1063/1.114851
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摘要: … Not only will the future of semiconductor integrated circuits be affected, but also the commercialization of many innovative devices which are far superior to current devices is hinged on …
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