作者: Junichi Fukuda , Makoto Kambara , Toyonobu Yoshida
DOI: 10.1016/J.TSF.2011.01.216
关键词:
摘要: Abstract Epitaxial silicon thick films have been deposited at around 400 °C by mesoplasma chemical vapor deposition with trichlorosilane (TCS) as source gas. The rate of the Si increases linearly TCS flow and reaches 30 nm/s 15 sccm TCS. These exhibited relatively high hall mobility (~ 200 cm2/V-s) independently rate.