Method for cutting semiconductor substrate

摘要: Multiphoton absorption is generated, so as to form a part which intended be cut 9 due molten processed region 13 within silicon wafer 11, and then an adhesive sheet 20 bonded the 11 expanded. This cuts along with high precision into semiconductor chips 25. Here, opposing sections 25a, 25a of neighboring 25, 25 are separated from each other their close contact state, whereby die-bonding resin layer 23 also 9. Therefore, can much more efficiently than in case where blade without cutting base 21.