Hybrid integrated circuit component
作者： Yukio Yamauchi , Katsuto Nagano , Michio Arai , Naoya Sakamoto
DOI:
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摘要: A hybrid (composite) integrated circuit element comprises a substrate, thin film type formed on substrate through process, and lamination passive such as capacitor, inductor, resitance combination thereof the circuit. During firing of in hydrogen atmosphere, semiconductor layer which constitutes is also heat annealed. Various substrates can be used for example, quartz, ceramic cheap has not been treated with mirror-grinding by use glass layer.
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