Manufacturing an electrical device

摘要: Laser irradiation is used to depolymerise surplus encapsulation which in the form of a thin film extending from an device. Where sheet lying for example over heatsink or and between leads laser may also vaporise without damage underlying parts present as surface layer at external encapsulation, depolymerised be removed by dry grinding with relatively soft medium. radiation CO2 operating 10.6 microns power density 4.5 22.5MWcm . The device semiconductor