Laser machining of molded assemblies
作者： Lance L. Andrus , Jeffrey A. Curhan
DOI:
关键词:
摘要: A heat generating component is encapsulated within an encapsulant. window made in the encapsulant to expose a dissipating surface of and sinking device attached component. The formed using laser.
lens.org 参考文章(9)
John C Traweek, Electronic assembly utilizing thermal panel for heat sink ,(1970)
Walter R. Hedlund, Stephen R. Pullen, Packaging electrical components having a scallop formed in an edge of a circuit board ,(1994)
Andrew J. Pines, Assembly for integrating heat generating electronic device with nonheat generating devices ,(1993)
Patrizio Vinciarelli, Fred Finnemore, John S. Balog, Brant T. Johnson, Packaging electrical components ,(1993)
Len L. Picard, Ralph D. Mayer, Clifford T. Fitzgerald, System for frontal illumination ,(1992)
Roman Katchmar, Printed circuit boards and heat sink structures ,(1993)
H. Green, M. P. Skinner, REDUCING MCM FABRICATION COSTS Electronic packaging and production. ,vol. 36, ,(1996)
Masahiro Mori, Takeshi Takeyama, Takuji Asai, Electronic component mounting board equipped with heat dissipating member ,(1991)
Joseph Bell Titterington, Manufacturing an electrical device ,(1985)