Etch-back apparatus for integrated circuit failure analysis

摘要: An apparatus and a method to inhibit sputtering of undesirable material onto dielectric layer an integrated circuit being etched. After exposing the within its package, leads are electrically coupled together by metallic foil. The foil is wrapped about package also provide thermal coupling, however, left exposed. Then, placed etch-resilient plate disposed atop cathode electrode. opening in allows direct placement cathode. cover above circuit, but has expose circuit. During etching, inhibits from leads, preform bond wires.