Method and apparatus for processing substrate and plate used therein
作者： Katsuhiko Shirasawa , Yosuke Inomata
DOI:
关键词:
摘要: A substrate processing apparatus that roughens the surface of a through dry etching method by covering to be processed with plate provided number opening portions. The is portions in such manner an open area ratio on peripheral side smaller than central portion when viewed plane. It thus possible form textures efficiently and homogenously, which turn makes it manufacture highly efficient solar cells or like at low cost.
lens.org 参考文章(39)
Mikitaka Itoh, Yasuyuki Inoue, Takashi Saida, Yasuhiro Hida, Silica-based optical waveguide circuit and fabrication method thereof ,(2002)
Aharon Z. Hed, Method of making a josephson junction ,(1992)
Masahiro Hatakeyama, Takao Kato, Katsunori Ichiki, Yotaro Hatamura, Masayuki Nakao, Fabrication method with energy beam ,(1996)
Edmund T. Marciniec, Method of evaluating the cleanliness of silicon wafers ,(1974)
Mehrdad M. Moslehi, Shutter for thin-film processing equipment ,(1998)
Christopher E. Obszarny, Reactive ion etch chamber wafer masking system ,(1998)
Donald O. Smith, David M. Walker, John R. Burgess, Low defect etching of patterns using plasma-stencil mask ,(1985)
Masahiro Aoki, Hiroshi Sato, Makoto Suzuki, Masaaki Komori, Semiconductor guided-wave optical device and method of fabricating thereof ,(1996)
Isamu Namose, Semiconductor device manfuacturing apparatus ,(1993)
Kiyoji Ikeda, Tetsuya Hayashida, Plasma-etching apparatus ,(1979)