Heat treating apparatus

摘要: A heat treatment apparatus for semiconductor wafers is provided with a number, such as two, of units which are arranged horizontally and load wafer boats containing from below. delivery section to correspond each the two units, conveyed by transfer mechanism between units. Carrier accommodation racks in upper lower positions across manner that they can be used common both sections. The carrier front order convey carriers stages at portions apparatus, racks, By making mechanism, number increased single unit, more efficiently, area taken up reduced.