Dry etching method, microfabrication process and dry etching mask

作者: Kazuhiro Hattori , Kenji Uchiyama

DOI:

关键词:

摘要: A dry etching is performed using a mask made of titanium nitride under reaction gas carbon monoxide with an additive nitrogen containing compound gas.

参考文章(27)
Takashi Akahori, Tadashi Hirata, Shunichi Endo, Takeshi Aoki, Shuichi Ishizuka, Process for the production of semiconductor device ,(1997)
Arthur Hungshin Tao, Yong-Chang Feng, Cheng Tzong Horng, Cherng-Chyi Han, Pole trimming technique for high data rate thin film heads ,(1996)
Stephen P. DeOrnellas, Leslie G. Jerde, Alferd Cofer, Method for using a hard mask for critical dimension growth containment ,(1999)
Ravi Iyer, Jigish D. Trivedi, Conductive structure in an integrated circuit ,(2001)
Ronald A. Barr, Ming Zhao, Kenneth E. Knapp, James Spallas, Benjamin P. Law, Matthew Gibbons, Thin film read head structure with improved bias magnet-to-magnetoresistive element interface and method of fabrication ,(2002)
I. Nakatani, Ultramicro fabrications on Fe-Ni alloys using electron-beam writing and reactive-ion etching IEEE Transactions on Magnetics. ,vol. 32, pp. 4448- 4451 ,(1996) , 10.1109/20.538896