A method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability
作者： Sidlgata V. Sreenivasan , Michael P. C. Watts
DOI:
关键词:
摘要: The present invention is directed to a method of and mold (14) for arranging features on substrate (12) replicate the with minimal dimensional variability. includes layer minimize thickness variations in that are attributable density plurality layer. transferred into an underlying (12). It believed by forming so as define uniform fill factor layer, may be reduced, if not abrogated. To end, one accordance flowable material (24) Thereafter, formed region (24). arranged provide substantially region.
glgoo.top参考文章(488)
Yaw S. Obeng, Integrated circuit manufacturing ,(1994)
Jr. David A. Cathey, Process for fabricating conductors used for integrated circuit connections and the like ,(1990)
Roger A. Kane, Merchandise theft deterrent sensor ,(1987)
Michael J. Giuglianotti, Bhupendrarai C. Desai, John Doyle, Protective member for display system having 99% UV light blocking ability and improved thermal coefficient of expansion ,(1995)
G. K. Ananthasuresh, Sridhar Kota, Noboru Kikuchi, Strategies for systematic synthesis of compliant mems Proceedings of the 1994 International Mechanical Engineering Congress and Exposition. ,(1994)
Henry Louis Laquer, Method for deforming solids in a controlled atmosphere and at adjustable rates, pressures and temperature ,(1999)
Phillip L. Corson, Jason M. Parry, William F. Pokorny, Gary R. Holsopple, Method for forming graphical images in semiconductor devices ,(2000)
Seiji Takei, XY-positioning table ,(1987)
Paul C. Watson, Remote axis admittance system ,(1978)
Vincent DiMilia, John M. Warlaumont, Variable magnification mask for X-ray lithography ,(1991)