Recrystallization induced by subgrain rotation in Pb-free BGA solder joints under thermomechanical stress
作者： J. Han , F. Guo , J.P. Liu
DOI: 10.1016/J.JALLCOM.2016.12.281
关键词:
摘要: … However, we could still calculate the rotation angles of some of the recrystallized grains, which will be addressed in our next study. The newly formed recrystallized grains with high-…
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