Semiconductor structure, semiconductor chip and method of manufacturing the semiconductor structure
作者： Lin Shian-Jyh
DOI:
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摘要: A semiconductor structure is provided. The includes a substrate, plurality of one-time-programmable (OTP) cells, bottom cell plate, top plate and decoupling capacitor array. substrate active areas at least one isolation provided between the to isolate from another. OTP cells are disposed in areas, on over plate. array overlies cells.
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