Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package
作者： Gyung-Hwan Oh , Dong-Woon Park , Dug-Joong Kim , Hak-Sung Kim
DOI: 10.1109/IRMMW-THZ.2018.8510029
关键词:
摘要: The refractive index and thickness of EMC were measured non-destructively using the terahertz time-domain spectroscopy (THz-TDS) system. A theoretical model was developed an analysis time response on transmission reflection THz signals. Using this model, within 1% error range. Simultaneously, calculated through induced delay. As a result, range 0.9% 3.0%, respectively.
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