Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy
作者： Sung-Hyeon Park , Jin-Wook Jang , Hak-Sung Kim
DOI: 10.1088/0960-1317/25/9/095007
关键词:
摘要: … , were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at …
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Mark I. Montrose, EMC and the printed circuit board : design, theory, and layout made simple ,(1999)
Kirstin Kriz, Filiz Ibraimi, Min Lu, Lars-Olof Hansson, Dario Kriz, Detection of C-Reactive Protein Utilizing Magnetic Permeability Detection Based Immunoassays Analytical Chemistry. ,vol. 77, pp. 5920- 5924 ,(2005) , 10.1021/AC0508649
M. A. Ordal, Robert J. Bell, R. W. Alexander, L. L. Long, M. R. Querry, Optical properties of fourteen metals in the infrared and far infrared: Al, Co, Cu, Au, Fe, Pb, Mo, Ni, Pd, Pt, Ag, Ti, V, and W. Applied Optics. ,vol. 24, pp. 4493- 4499 ,(1985) , 10.1364/AO.24.004493
Y Ju, M Saka, H Abé, Detection of delamination in IC packages using the phase of microwaves Ndt & E International. ,vol. 34, pp. 49- 56 ,(2001) , 10.1016/S0963-8695(00)00044-X
Chang K. Hong, Richard P. Wool, Development of a bio‐based composite material from soybean oil and keratin fibers Journal of Applied Polymer Science. ,vol. 95, pp. 1524- 1538 ,(2005) , 10.1002/APP.21044
Guang-Ming Zhang, David M. Harvey, Derek R. Braden, Microelectronic package characterisation using scanning acoustic microscopy NDT & E International. ,vol. 40, pp. 609- 617 ,(2007) , 10.1016/J.NDTEINT.2007.05.002
Mira Naftaly, Robert E. Miles, Terahertz Time-Domain Spectroscopy for Material Characterization Proceedings of the IEEE. ,vol. 95, pp. 1658- 1665 ,(2007) , 10.1109/JPROC.2007.898835
Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao, Using active thermography for defects inspection of flip chip Microelectronics Reliability. ,vol. 54, pp. 808- 815 ,(2014) , 10.1016/J.MICROREL.2013.12.015
An automated ultrasonic inspection approach for flip chip solder joint assessment Microelectronics Reliability. ,vol. 52, pp. 2995- 3001 ,(2012) , 10.1016/J.MICROREL.2012.07.018
Eun-Beom Jeon, Jae-Dong Park, Jung Han Song, Hye Jin Lee, Hak-Sung Kim, Bi-axial fracture strength characteristic of an ultra-thin flash memory chip Journal of Micromechanics and Microengineering. ,vol. 22, pp. 105014- ,(2012) , 10.1088/0960-1317/22/10/105014