Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics
作者： Manseok Park , Soojung Baek , Sungdong Kim , Sarah Eunkyung Kim
DOI: 10.1016/J.APSUSC.2014.10.098
关键词:
摘要: … on the Cu surface and the effect of Cu surface modified by plasma on Cu-to-Cu bonding … Ar plasma treatment on the Cu surface prior to Cu-to-Cu bonding was evaluated in this study. …
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