Vacuum processing apparatus and operating method thereof
作者： Yutaka Kudo , Ryoichi Isomura , Takahiro Shimomura
DOI:
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摘要: An operating ratio is improved in a vacuum processing apparatus to which plurality of transfer chambers are connected through intermediate chamber. In method the having chamber and vessels chambers, respectively, made communicate chamber, purge gas supplied lock an inside far from decompressed/exhausted, pressures all raised be higher than pressure vessel.
lens.org 参考文章(11)
Peter van der Meulen, Semiconductor manufacturing systems ,(2008)
Atsushi Shimoda, Takafumi Chida, Hideaki Kondo, Keita Nogi, Teruo Nakata, Susumu Tauchi, Vacuum processing system and vacuum processing method of semiconductor processing substrate ,(2010)
Olli Jylhä, Eric J. Shero, Christophe Pomarede, Reduced cross-contamination between chambers in a semiconductor processing tool ,(2003)
Hiroyuki Nakayama, Junji Oikawa, Jun Yamawaku, Transfer chamber and method for preventing adhesion of particle ,(2010)
Toru Ito, Eiji Matsumoto, Atsushi Yoshida, Kotaro Fujimoto, Kouta Tanaka, Vacuum Processing Apparatus And Vacuum Processing Method Using The Same ,(2007)
Suzuka Nishimura, Kazuhiro Haga, Hiroshi Kawamura, Hirosi Nagayoshi, Kazutaka Terashima, Method for Manufacturing Compound Semiconductor and Apparatus for Manufacturing the Same ,(2007)
Hyung-Joon Kim, Ki-Yung Lee, Seung-bae Lee, Dae-Hyun Yang, Apparatus for manufacturing semiconductor device ,(2007)
竜大 田口, Tatsuhiro Taguchi, Vacuum processing apparatus ,(2004)
Nabeyama Yuki, Akihiko Shimura, Hiroshi Kondo, Vacuum processing apparatus ,(2009)