Electron microscope studies of an alloyed Au/Ni/Au‐Ge ohmic contact to GaAs

作者: T. S. Kuan , P. E. Batson , T. N. Jackson , H. Rupprecht , E. L. Wilkie

DOI: 10.1063/1.332011

关键词:

摘要: … Since the NiAs phase is agglomerated at the Ni-Au-Ge/GaAs interface as observed in this work, the contact interface thus consists of "good" contact areas (Ni2GeAs) and "poor" contact …

参考文章(8)
N. Braslau, Alloyed ohmic contacts to GaAs Journal of Vacuum Science and Technology. ,vol. 19, pp. 803- 807 ,(1981) , 10.1116/1.571152
P. A. Barnes, A. Y. Cho, Nonalloyed Ohmic contacts to n‐GaAs by molecular beam epitaxy Applied Physics Letters. ,vol. 33, pp. 651- 653 ,(1978) , 10.1063/1.90451
N. Braslau, J.B. Gunn, J.L. Staples, Metal-semiconductor contacts for GaAs bulk effect devices Solid-state Electronics. ,vol. 10, pp. 381- 383 ,(1967) , 10.1016/0038-1101(67)90037-8
P.E. Batson, G. Trafas, The IBM computer-stem system Ultramicroscopy. ,vol. 8, pp. 293- 300 ,(1982) , 10.1016/0304-3991(82)90246-7
M. Wittmer, R. Pretorius, J.W. Mayer, M-A. Nicolet, Investigation of the AuGeNi system used for alloyed contacts to GaAs Solid-state Electronics. ,vol. 20, pp. 433- 439 ,(1977) , 10.1016/0038-1101(77)90136-8
Masaki Ogawa, Alloying behavior of Ni/Au‐Ge films on GaAs Journal of Applied Physics. ,vol. 51, pp. 406- 412 ,(1980) , 10.1063/1.327387
W.T. Anderson, A. Christou, J.E. Davey, Development ot ohmic contacts for GaAs devices using epitaxial Ge films IEEE Journal of Solid-state Circuits. ,vol. 13, pp. 430- 435 ,(1978) , 10.1109/JSSC.1978.1051073