作者: Arthur H. Rogove , Charles Balian , Steve Bergerson , James H. Duvall
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摘要: A thermal interface material (A) transfers heat from a source (12), such as microprocessor, to sink (14) for maintaining the microprocessor at safe operating temperature. The includes thermally conductive filler particles dispersed in phase change material. softens and flows temperature of source, thereby providing good contact with uneven surfaces sink, without excessive exudation loss polymer component, an elastomer, melting point which adjusts softening source.