Resist coating and developing unit

摘要: In a transferring region of wafer portion that transfers placed in carrier loading and unloading portion, pattern inspecting for resist accommodating determined as an unacceptable are disposed. The is conveyed to external cleaning portion. Resist on the cleaned removed. resultant loaded coating developing unit. film thickness monitor measured by measuring disposed Thereafter, entire surface removed with thinner supplied from solvent nozzle. Thus, regenerated. Consequently, when unit operated substrate have been processes inspected, throughput becomes high can be automatically performed.