Reduced footprint tool for automated processing of microelectronic substrates
作者： Sean D. Simondet , Quirin W. Matthys , Todd K. Maciej , David C. Zimmerman , Robert E. Larson
DOI:
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摘要: The present invention provides tools and methods of processing microelectronic substrates in which the maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, novel tool designs multiple functions are overlapped x, y, and/or z axes ways.
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