On the influence of boron-addition on TLP bonding time in a Ni3Al-based intermetallic
作者： A. Ghoneim , O.A. Ojo
DOI: 10.1016/J.INTERMET.2009.10.011
关键词:
摘要: Transient liquid phase (TLP) bonding of boron-bearing and boron-free single crystals a Ni3Al-based intermetallic alloy IC 6 was performed to study the influence boron addition base-material on isothermal solidification completion time, tf, required prevent formation deleterious joint centerline eutectic microconstituent. The result showed that did not prohibitively prolong tf as predicted by theoretical TLP models. deviation from prediction is attributable microsegregation behaviour atoms during directional cast 6.
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