Method and apparatus for strain monitoring of printed circuit board assemblies

摘要: A technique of monitoring strain on a printed circuit board assembly involves the use detector (20) mounted (24). The is formed non-ductile material. has narrowed portion (70) forming weak link that characteristic breaking when critical limit exceeded. method can include visual or electrical inspection. inspection having device (92). timer (94) connected to at least one and memory (96) for storing results timer. capacitance detectors sampled any change in recorded memory. In embodiment, time stamp occurs based an property changes across detectors.