作者: David A. Daycock , Curtis R. Olson , Shawn D. Lyonsmith , Paul A. Morgan
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摘要: Methods for reducing electron beam induced damage on semiconductor substrates employ compositions such as small chain organic solvents and non-neutral pH solutions to reduce or eliminate charge imbalances caused by inspection of the substrates. Damage processes may also be reduced generating otherwise forming passivation films a substrate following inspection.