Process and system for rinsing of semiconductor substrates

摘要: Semiconductor substrates, particularly metallized substrates such as partially processed wafers, are rinsed with an aqueous medium, preferably deionized water, which further contains anti-corrosive chemical agent or agents selected so to minimize corrosion of metals resulting from contact the water. The amount is maintained in a controlled manner at predetermined level within range rinsing medium containing anticorrosive also carried out for specified time, followed by water alone. may be combined, either same vessel different vessel, subsequent drying step, process utilizing vapor introduced into rinse tank downstream vessel. condenses on surface semiconductor material and reduces tension residual fluid, causing fluid flow off surface.