High density plasma CVD reactor with combined inductive and capacitive coupling

作者: Fred C. Redeker , Kevin Fairbairn , Romuald Nowak

DOI:

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摘要: The invention is embodied in a plasma reactor having vacuum chamber with cylindrical side portion and ceiling at certain height above the top of portion, wafer-holding pedestal near bottom chamber, gas injection ports pump, including generally planar disk-shaped conductive electrode adjacent ceiling, helical coil antenna winding corresponding to second diameter electrode, substantially spanning between switch for individually connecting each one antenna, wafer (a) respective RF power source or (b) ground (c) floating potential (i.e., unconnected any source). also coplanar base coinciding circumference source, potential. In embodiment, chemical vapor deposition reactor.

参考文章(12)
David W. Groechel, Kenneth S. Collins, Jerry Yuen-Kui Wong, Chan-Lon Yang, Jeffrey Marks, Peter R. Keswich, Plasma etch process and plasma processing reactor ,(1992)
Raymond L. Degner, Eric H. Lenz, Composite electrode for plasma processes ,(1990)
David W. Groechel, Craig A. Roderick, D. Pinson Ii Jay, John R. Trow, Kenneth S. Collins, Peter R. Keswick, Masato M. Toshima, Chan-Lon Yang, Jeffrey Marks, Gerald Z. Yin, Jerry Y. Wong, Tetsuya Ishikawa, Lawrence C. Lei, Silicon scavenger in an inductively coupled RF plasma reactor ,(1993)
Kevin Fairbairn, Romuald Nowak, High density plasma CVD and etching reactor ,(1994)
Jeffrey C. Benzing, J. Kirkwood H. Rough, Eliot K. Broadbent, Induction plasma source ,(1992)
Keith Howard Bayliss, Gary Proudfoot, Mervyn Howard Davis, Plasma apparatus electrode assembly ,(1990)
David W. Groechel, Kenneth S. Collins, Jerry Yuen-Kui Wong, Chan-Lon Yang, Jeffrey Marks, Peter R. Keswich, Plasma etch process ,(1992)