Hybrid metal interconnects with a bamboo grain microstructure
作者： Chih-Chao Yang , Lawrence A. Clevenger , Michael Rizzolo , Benjamin D. Briggs
DOI:
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摘要: A method of forming an interconnect with a bamboo grain microstructure. The includes conductive filler layer in trench insulating to predetermined depth such that aspect ratio top portion the is reduced threshold level, depositing metal over trench, having plurality small grains, and annealing provide microstructure larger grains than boundaries grains.
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