Power Sandwich: An integration technology for manufacturability
作者： J. A. Ferreira , J. Popovic-Gerber , I. Josifovic
DOI: 10.1109/IPEC.2010.5543737
关键词:
摘要: This paper presents a novel power electronics construction technology for surface mount (SMT) automated manufacturing of converters– Power Sandwich. The Sandwich method employs new x-dimension components, having the same height (x) and double sided SMT electrical terminations. components are stacked between planar substrates can be soldered on both, top bottom sides using multilayer assembly process. process is compatible with standard line some alternations. By arranging in different stack layers an increase density better heat removal from systems achieved. enabling integration achieving both high densities converters.
sci-hub.se 参考文章(7)
J.D. van Wyk, F.C. Lee, D. Boroyevich, Zhenxian Liang, Kaiwei Yao, A future approach to integration in power electronics systems conference of the industrial electronics society. ,vol. 1, pp. 1008- 1019 ,(2003) , 10.1109/IECON.2003.1280119
I. Josifovic, J. Popovic-Gerber, J. A. Ferreira, New power electronics components concept for automated manufacturing european conference on power electronics and applications. pp. 1- 10 ,(2009)
I. Josifovic, J. Popovic-Gerber, J.A. Ferreira, A PCB system integration concept for power electronics international power electronics and motion control conference. pp. 756- 762 ,(2009) , 10.1109/IPEMC.2009.5157486
I. Josifovic, J. Popovic-Gerber, J. A. Ferreira, New double sided SMT power inductor the international power electronics conference - ecce asia. pp. 3144- 3150 ,(2010) , 10.1109/IPEC.2010.5544635
Jelena Popovic-Gerber, Mark Gerber, Braham Ferreira, New system integration concept for high power density drives power electronics specialists conference. pp. 4208- 4214 ,(2008) , 10.1109/PESC.2008.4592617
I. Josifovic, J. Popovic-Gerber, B. Ferreira, Thermally enhanced SMT power components energy conversion congress and exposition. pp. 1017- 1024 ,(2009) , 10.1109/ECCE.2009.5316055
Ralph Remsburg, Thermal Design of Electronic Equipment CRC Press. ,(2000) , 10.1201/9781420042368