Thermally enhanced SMT power components
作者： I. Josifovic , J. Popovic-Gerber , B. Ferreira
DOI: 10.1109/ECCE.2009.5316055
关键词: Power density 、 Surface-mount technology 、 Potting 、 Materials science 、 Heat sink 、 Thermal resistance 、 Heat transfer 、 Stack (abstract data type) 、 Mechanical engineering 、 Electronic packaging
摘要: The paper introduces new x-dimension (x-dim) components that allow for high packaging density and automated manufacturing of power converters. x-dim are double sided SMT passives, having uniform height (x) enhanced thermal properties. With stacked converter construction the soldered to two sides, heat removal from systems can be significantly improved. This publication presents various methods manufacture thermally components. behaviour is improved by integrating extractors, removing materials filling air gaps potting compounds. In construction, enhancement one component improves other components, placed in adjacent stack layers. Thermal performance both standard constructions evaluated FEM analytical simulations. New employed play a key role overcoming current limits.
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