作者: Tzung-I Su , Ming-I Wang , Li-Hsun Ho , Bang-Chiang Lan , Hui-Min Wu
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摘要: A method for fabricating a MEMS is described as follows. substrate provided, including circuit region and separated from each other. first metal interconnection structure formed on the in region, simultaneously dielectric region. second structure, at least two layers one protection ring are structure. The connects adjacent to define an enclosed space between layers. outside removed form device