作者:
DOI: 10.1016/J.MICROREL.2014.07.008
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摘要: Smart, electronic textiles are often exposed to tensile stress which can lead fracture of the interwoven conducting yarns. In this study, a model is proposed relate extensibility yarns weaving pattern textile – in particular thickness and pitch The validated by simultaneous mechanical electrical tests on bare extracted from several textiles. results show that failure precedes failure. Thus, lower conservative bound for be obtained prediction as function structure weave.