Molecular Level Understanding of Adhesion Mechanisms at the Epoxy/Polymer Interfaces
作者： Chi Zhang , Jeanne Hankett , Zhan Chen
DOI: 10.1021/AM300854G
关键词:
摘要: It is important to understand the buried interfacial structures containing epoxy underfills as such determine adhesion properties. Weak or delamination at interfaces leads failure of microelectronic devices. Sum frequency generation (SFG) vibrational spectroscopy was used examine polymer/model and polymer/commercial resins (used in flip chip devices) molecular level. We investigated a model epoxy: bisphenol A digylcidyl ether (BADGE) poly (ethylene terephthalate) (PET) before after curing. Furthermore, small amounts different silanes including (3-glycidoxypropyl) trimethoxysilane (γ-GPS), (3-Aminopropyl)trimethoxysilane (ATMS), Octadecyltrimethoxysilane (OTMS(18C)), Octyltrimethoxysilane (OTMS(8C)) were mixed with BADGE. Silane influences on polymer/epoxy studied. SFG also study between polymers and...
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