Low-k interlevel dielectric materials and method of forming low-k interlevel dielectric layers and structures
作者： Teddie Peregrino Magbitang , Muthumanickam Sankarapandian , Linda Karin Sundberg , Geraud Jean-Michel Dubois , Willi Volksen
DOI:
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摘要: A composition of matter and a structure fabricated using the composition. The comprising: resin; polymeric nano-particles dispersed in resin, each nano-particle comprising multi-arm core polymer pendent polymers attached to polymer, immiscible with resin miscible solvent, solvent volatile at first temperature, cross-linkable second decomposable third temperature higher than wherein thickness layer shrinks by less about 3.5% between heating from temperature.
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