Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
作者： Tighe A. Spurlin , David W. Porter , Ludan Huang , James E. Duncan , Hyosang S. Lee
DOI:
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摘要: Apparatus and methods for electroplating metal onto substrates are disclosed. The apparatus comprise an cell at least one oxidization device. comprises a cathode chamber anode separated by porous barrier that allows cations to pass through but prevents organic particles from crossing. oxidation device (ODD) is configured oxidize of the be electroplated substrate, which present in anolyte during electroplating. In some embodiments, ODD implemented as carbon removes Cu(I) electrochemically. other oxygenation (OGD) or impressed current cathodic protection (ICCP anode), both increase oxygen concentration solutions. Methods efficient also
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