System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
作者： Charles L. Arvin , Tracy A. Tong , Glen N. Biggs , Freddie Torres , Joseph C. Sorbello
DOI:
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摘要: Electroplating techniques including a system for treating solution use in an electroplating application and method using the are provided. The can have: gas dispersing portion configured to treat by into control concentration of predetermined cation metal be electroplated application; filter filtering remove quantity residue; circulation mechanism divert one plating tool combination based on result analysis solution.
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