Electrolytic plating equipment and electrolytic plating method

作者: Kanako Matsuda , Toshihisa Isono , Shunsaku Hoshi , Naoyuki Omura , Koji Shimizu

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摘要: An electrolytic plating equipment includes: a tank for holding solution; and separate apart from the tank, solution circulating between tank. The contains first space second located downstream space. in an amount exceeding specific height flows into space, falls through air

参考文章(5)
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Francis J. Figiel, Harry F. Osterman, Apparatus for removal of surface films from non-absorbent articles ,(1986)