摘要: A variety of deposition techniques are employed for ferroelectric thin film capacitors to be used in memory devices. These include sputtering [382], MOCVD (Metal-Organic Chemical Vapour Deposition) [383], MOD (MetalOrganic Decomposition) [384], PLD (Pulsed Laser [385], solgel (solution—gelation) spin-on [386], and a mist which stoichiometrically correct submicron droplets sprayed into the chamber [387]. The flash process [388, 389, 390, 391, 392] precursor solutions delivered liquid form (due their low volatilities) then flashed vapour phase via incandescent lights or laser sources at shower head delivery point just below wafer. systems all differ from each other (Isobe’s achieves highest rate), have separate patents. What they share is ability handle viscous precursors with pressures. [The LG Semiconductor Corp. BST utilizes relatively barium- strontium-(THD)2-tetraglyme, together Ti(O-iso-Pr)(THD)2.] True CVD not used; that is, chloride hydride precursors, since halogen contamination problem. MBE (Molecular Beam Epitaxy) generally used, one two research exceptions [393]. And thick such as spray pyrolysis, slip-casting, etc., used.