Copper bump barrier cap to reduce electrical resistance
作者： Ebrahim Andideh , Baohua Niu , Ting Zhong , Gerald Leatherman , Shriram Ramanathan
DOI:
关键词:
摘要: A controlled collapse chip connection (C4) comprises a copper metal C4 bump formed on an integrated circuit substrate, where the includes barrier cap to prevent electromigration of metal. The is from nickel or cobalt and it can either be top surface encapsulate bump. method forming with providing depositing photoresist layer exposing developing form opening, into opening bump, plating onto stripping layer.
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