Doping Minor Elements into Metal Bumps
作者： Cheng-Chung Lin , Ming-Che Ho , Ming-Da Cheng , Zheng-Yi Lim , Hui-Jung Tsai
DOI:
关键词: Metal 、 Doping 、 Metallurgy 、 Minor element 、 Substrate (printing) 、 Materials science 、 Soldering
摘要: A method of forming a device includes providing substrate, and solder bump over the substrate. minor element is introduced to region adjacent top surface bump. re-flow process then performed drive into
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