Heat-dissipating member and joined structure

摘要: It is an object of the present invention to provide a heat-dissipating member, which has excellent handling property at room temperature and can tightly adhere heat generating element sink by being interposed between having high flexibility efficiently conduct generated from keep state adherence even in increasing temperature, joined structure obtainable joining with member. The relates comprises thermoplastic resin composition containing thermally conductive fine particle not compound melting range 40 80° C., 23° storage modulus 0.1 Hz 50,000 Pa or larger member remains finite shape, 50 400 indefinite 100° 5,000 smaller shape.