Device for cooling semi-conductors
作者： Markus Grimmig , Jan Wenske
DOI:
关键词:
摘要: The device serves for cooling electronic structural elements and has a body metal base plate constructed as part of the support element. is arranged adjacent plate. A connecting element at least over areas between body. partially which melting temperature 60° C. provided with frame-like seal.
lens.org 参考文章(16)
Dane Lewis Schnal, Mark Jon Kukla, Lawrence Francis Rubin, Steven Craig Palomino, Glenn Bennett, Michael Robert Browning, Low stress optics mount using thermally conductive liquid metal or gel ,(2006)
Anthony Sayka, Fusion heat sink for integrated circuit ,(1993)
Ji-Cun Wang, Hui-Ling Zhang, You-Sen Wang, Yuan Yao, Feng-Wei Dai, Thermal interface material and method of using the same and electronic assembly having the same ,(2009)
Ryuuji Miyazaki, Masumi Suzuki, Heat sink with increased cooling capacity and semiconductor device comprising the hear sink ,(2007)
Michael H. Bunyan, Miksa de Sorgo, Conformal thermal interface material for electronic components ,(1997)
Hiroyuki Ryoson, Hiroyuki Nagai, Plate-type heat transport device and electronic instrument ,(2007)
Shunji Hyodo, Atsushi Hasegawa, Kenichi Azuma, Heat-dissipating member and joined structure ,(2003)
Theodore G. Van Kessel, Jeffrey D. Gelorme, Supratik Guha, Yves Martin, Nancy C. LaBianca, Heterogeneous thermal interface for cooling ,(2005)
Peter Ruzicka, Mark Sabatino, Brian J Edward, Method and apparatus for dissipating heat ,(2005)