Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
作者： Hideshi Tokuhira
DOI:
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摘要: In a method for manufacturing of an electronic component device in which and heat dissipating member are connected through conducting member, the semiconductor characterized by comprising steps forming one plate shape metallic recessed on vapor deposition processing or plating processing, other filling liquid metal part to form metal, into solid solution.
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