Method for manufacturing led chip with inclined side surface
作者： Tzu-Chien Hung , Chia-Hui Shen
DOI:
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摘要: A method for manufacturing an LED chip is disclosed wherein a substrate provided. first semi-conductor layer formed on the substrate. photoresist with inverted truncated cone shape and blocking inclined inner surface facing surrounding are layer. The removed epitaxial region surrounded by defined. lighting structure inside region. then exposed. Electrodes respectively electrically connected to structure.
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