作者: Andriy Hikavyy , Roger Loo , Benjamin Vincent
DOI:
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摘要: Disclosed are methods for selective deposition of doped Group IV-Sn materials. In some embodiments, the method includes providing a patterned substrate comprising at least first region and second region, where an exposed semiconductor material insulator material, performing two cycles grow-etch cyclic process. Each cycle depositing IV-Tin (Sn) layer, layer IV precursor, Sn dopant using etch gas to back deposited layer.