Thermal conductance of augmented pressed metallic contacts at liquid helium temperatures

作者: L.J. Salerno , P. Kittel , A.L. Spivak

DOI: 10.1016/0011-2275(93)90002-6

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摘要: The thermal conductance of uncoated oxygen-free high conductivity (OFHC) copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel sample pairs which were augmented with a gold coated aluminum washer inserted between the contact surfaces was measured over temperature range 1.6 to 6.0 K, applied forces from 22 670 N. prepared 0.8 micron lapped finish, while finish 0.2 lapped. contribution overall impedance by bulk negligible. It found that addition offered no significant improvement an single pair; any benefits using plated counteracted two more surfaces. Additionally, 'combination' pair having one surface compared pair. ratio half be constant near unity data obtained, within experimental error.

参考文章(4)
Peter Kittel, Louis J. Salerno, Alan L. Spivak, Thermal conductance of gold plated metallic contacts at liquid helium temperatures ,(1992)
L.J. Salerno, P. Kittel, W.F. Brooks, A.L. Spivak, W.G. Marks Jr, Thermal conductance of pressed brass contacts at liquid helium temperatures Cryogenics. ,vol. 26, pp. 217- 221 ,(1986) , 10.1016/S0011-2275(86)80002-9
L. J. Salerno, P. Kittel, A. L. Spivak, Thermal conductance of pressed copper contacts at liquid helium temperatures AIAA Journal. ,vol. 22, pp. 1810- 1816 ,(1984) , 10.2514/3.8856