Pixel multichip module design for a high energy physics experiment
作者： G. Cardoso , J. Andresen , J.A. Appel , G. Chiodini , D.C. Christian
DOI: 10.1109/NSSMIC.2003.1352000
关键词:
摘要: At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The composed of three layers. lowest layer formed by readout integrated circuits (ICs). back ICs in thermal contact with supporting structure, while top flip-chip bump-bonded to sensor. A low mass flex-circuit interconnect glued on this assembly, and IC pads are wire-bounded circuit. This paper presents recent results development prototype summarizes its performance characteristics.
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